High Thermal Conductivity: Efficiently transfers heat away from CPUs and computer chips to maximize cooling performance. Non-Conductive & Safe: Formulated with zero electrical conductivity to prevent short circuits and protect sensitive internal components. 10-Year Extended Durability: Fills microscopic gaps between the processor and heatsink to maintain thermal performance for up to a decade. Syringe Applicator with Rubber Cap: Convenient syringe design ensures precise application, while the airtight rubber cap prevents the compound from drying out between uses. Visual Syringe Measurement Scale: Clear graduation markings on the barrel allow users to easily track and control the amount of paste applied. Optimum Viscosity & Particle Density: Engineered particle size allows smooth, uniform spreading across various chip surfaces under cooler mounting pressure. RoHS-Compliant & Eco-Friendly: Made with environmentally safe, non-toxic materials that fully comply with hazardous substance standards.